ibm 22nm euv

Steels are noted for the plans of the development of lithographic process corporation IBM, from which it follows that the application of th technology utilized now will be continued, at least, before the adoption 22- nm of standards in the production logical microcircuits. In other words, the periods of the introduction of lithograph with the use â€œrigidâ€ ultraviolet radiation (EUV) thus far again move aside.

Izvestia not too pleasant for the producers, who count on EUV. Let us recall, it was previously assumed that the new technology will be inculcated with the adoption of standards 32 nm in 2009.

By the way, experts do not have unanimous opinion relative to in what way will go the development of lithographic technology in the branch as a whole. Equally attractively appears both EUV- lithograph and 193- nm immersion lithograph with the dual exhibition.

Now IBM uses the so-called dry 193- nm immersion lithograph for the release of logic circuits according to the standards 65 nm. In accordance with the plan, IBM will use the same technology for the production 45- nm instruments, and, the passage to the 45- nm to technical process will begin the already toward the end present year. When the 45- nm standard will be mastered, IBM will enlarge the application of 193- nm immersion lithograph n 3. - nm the technical process of production of logic circuits. The application of single and double exposure is provided for in this stage.

Finally, to 2011 entire the same immersion lithograph is planned to apply in the production according to the standards 22 nm. In the opinion of specialist IBM, to words of whom refer the source, this unique solution, which is plotted in the two-year-old period of development and the requirements, which appear upon transfer 22 nm.

Since existing equipment for lithograph with the wavelength 193 nm is applicable only for standards 40 nm, on the way to for standards 32 and 22 nm IBM it is necessary to solve the problem of increase in the resolution and to switch over to double exposure.

But as EUV? IBM does not manage to complete it to the moment of the adoption of standards 22 nm. EUV is not copied from calculations: IBM hopes that this technology will be finished somewhat later and it will be able to be crossed on the time of introduction in the production on 22- nm standards with the 193- nm by immersion lithograph.

Together with IBM work other companies: in 2005 AMD, Infineon technologies AG, Micron technology, ASML and KLA-Tencor formed the consortium INVENT, the program of activity of which was calculated for seven years. The sum of total investments in the development of promising technologies is 600 mln. dollars. Furthermore, supposedly, along the way, outlined BY IBM, will go other important producers, including Chartered semiconductor manufacturing, UMC and TSMC.

From its side, Intel it expects to inject technology EUV with the mastery 32- nm n.

IBM 22nm EUV

IBM 22NM EUV